The substrate is thoroughly cleaned to remove any dirt, oils, or oxidation. Common cleaning methods include abrasive blasting, acid cleaning, or electro-cleaning to ensure good adhesion of the electroplated layer.

After cleaning, the substrate may be activated by a chemical or electrochemical process. This step ensures that the surface is properly prepared for the plating process, promoting better metal adhesion.

The electroplating bath is prepared by dissolving metal salts in water along with other additives to control pH, temperature, and plating rate. The bath contains the metal ions that will be plated onto the substrate.

The substrate is submerged in the plating solution, and an electric current is applied. The substrate becomes the cathode (negative terminal), and the anode (positive terminal) is typically made of the metal to be plated. Metal ions from the solution are reduced onto the substrate surface, forming the coating.

After electroplating, the part may undergo post-plating treatments such as rinsing, drying, polishing, or additional coatings. This step helps to remove any residual plating solution and improve the final appearance and performance of the plated part.